Semiconductor Packaging Materials Inc

1 Labriola Court
Armonk NY New York
United States 10543

Phone: +1 914 273 5500, Fax: +1 914 273 2065

Web: http://www.sempck.com

Tags: contract ingots metals packaging stampings

Semiconductor Packaging Materials, Inc. - Home Home Services / Product Select Mailing List Preform Tool List ____________________ Cladding Spheres Stamping Strip Tape on Reel Waffle Pack Wire Products Services Online Services Quality Investors Data Sheets News Careers Contact Materials Manufacturing SPM offers advanced metal materials including Bonding Wire, Bonding Ribbon, Eutectic Solder preforms (Die Attach), Metal Clad Materials, and Precision Metal Stampings for automotive, medical, and electronic packaging applications. Contract Packaging Services Highly automated, cost effective placements of your components into waffle pack or tape on reel is available at any of our 3 global locations (USA, Morocco, or Malaysia) 1 Labriola Court Armonk NY, 10504 Phone: (914) 273-5500 Fax: (914) 273-5860 E-Mail: info@sempck.com © Copyright Semiconductor Packaging Materials Corporation 2001-2007 Terms of Use