Car Brite, Inc.
1910 S. State Ave
Indianapolis IN Indiana
United States 46203
Indianapolis IN Indiana
United States 46203
Phone:
+1 317 788 9925, Fax: +1 317 781 3292
Tags:
flux Indianapolis urethane
Indianapolis
Dynaloy: Photoresist Strippers, Flux Removers, Stencil Cleaners, Microelectronics Cleaners, Urethane Solvents, Epoxy Solvents • Advanced Cleaners for IC and related applications • Photoresist Removers • Flux Removers • Electronic Cleaners • Encapsulant Removers • Urethane Removers NEWS & EVENTS Semicon West, July 16-20 Peaks Wafer Level Packaging, September 5-7, Whitefish, MT Semicon Taiwan, September 12-14, Taipei, Taiwan IWLPC, September 17-19, San Jose, CA Joint sales and distribution agreement of Electronic Materials for 'Wafer Level Packaging' Dynaloy TM LLC Announces Advanced Thick Photoresist Remover Dynaloy TM LLC Welcomes Mr. Satoshi Kumasaka Sign up to receive the Dynaloy newsletter! TECH BULLETIN SPOTLIGHT ANALYSIS OF OPTICAL MICRO LENSES AFTER WAFER-LEVEL CLEANING PROCESSES Imaging in handheld cameras is changing. Consumers are demanding images that are comparable to those seen in National Geographic and that can be achieved without a large amount of processing or sophisticated equipment. As the megapixel counts of sensors lose their historically direct correlation with image quality, creativity is needed in the search for commercial advantage, resulting in changes in everything from the design of the image sensors to the architecture of handsets and video cameras. A common approach to improve resolution is to use encapsulated lens materials on high performance image sensors which focus incident light on the pixel regions. To incorporate these sensitive materials, compatible down-stream processes, particularly those associated with packaging, are necessary. Examples include compatibility with photoresist removal and compatibility with etch processes to remove seed layer metals. Preferably the packaging is done at the wafer level in order to exploit the low cost and high yield of this method of assembly. Read More... (a) (b) Figure 1. (a) Microscope image of a dummy wafer with micro lenses after cleaning, (b) Microscope image of a CMOS image sensor wafer after cleani
