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Scan3D Phased Array Immersion Scanner
Company:
TecScan
Address1:
75 De Mortagne Blvd.
Address2:
Suite 122
City:
Boucherville
State:
QC
Country:
Canada
TecScan is proud to introduce Scan3D™, a family of High Precision
Immersion Scanners. Combined with TecView3D and our Gimbal/Gimbal, Scan3D revolutionizes the ultrasonic scanning process. With Scan3D, the scan- plans of the parts are directly imported from the CAD files and C- Scans are performed simultaneously in Through-Transmission and Pulse-Echo. Results are then displayed on the imported 3D model for analysis. Scan3D allows you to perform advanced contour following with arbitrary motion and following the shape of any curved part. The capabilities of this Immersion Scanner are numerous; users can combine the automated teach and learn with the imported 3D CAD of the part to generate scan-plans and perform complex 3D contour following.
TecViewTM3D is at the heart of Scan3D immersion scanner solution. With its
added capabilities in term of complex 3D motion control, interactive inspection
plan- ning and variety of analysis tools, the Scan3D has un matched
scanning features. Complex ultrasonic inspec- tions can be performed quickly
and easily. For part im- port, normalized 3D step file format is used. Once CAD
geometry is imported, Scan3D associates the part surfaces to the
appropriate scanner axes and creates a parametric space that defines the
surface. TecView3D also provides Sound Path Calculation capabilities. This
module is very useful when combined with teach and learn process. It can
calcu- late the entry and exit points of the ultrasonic waves and ensure an
optimal sound transmission and reception.
TecView3D also allows live data analysis creating C-Scans as soon as the
first A-Scans appears on the screen. We could define up to 16 gates to op-
timize data analysis by performing amplitude, time-of-flight and thickness
based C-Scan imaging simultaneously. Plus, material interface gate type can
be used to identify and define different material layers, allowing for depth or
thick- ness measurements to be done on each existing material layer.
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