Mistras Group
Polishing Corporation of America
442 Martin Ave 
Santa Clara CA California
United States 95050
Phone: +1 408 988 6000, Fax: +1 408 988 0787
Keywords: Electronics and Electrical Semiconductors
Polishing of silicon wafers from 1" to 12" including oxides, metals, wafer reclaim and stripping, slicing, lapping, polishing.
Silicon Wafers CLICK BELOW FOR A QUOTE Click Here for Silicon Wafers Click Here for Thin Films Click Here for SOI SILICON WAFERS: SILICON WAFERS FROM 1? TO 12? AS WELL AS CUSTOMIZED DIAMETERS. 1500 PCS OF 300MM VIRGIN Si WAFERS IN STOCK. BEST PRICE. BEST DELIVERY. BEST QUALITY. CALL/EMAIL ASAP. THIN FILMS: OXIDES: LTO, THERMAL, DOPED, TEOS NITRIDE: LPCVD, PECVD METALS: Ti,TiN, TiW, W, Al, Au, Cu SPECIAL WAFERS: EPI & POLY WAFERS SOI OR BONDED WAFERS TWO SIDE POLISHED WAFERS ULTRA FLAT AND ULTRA THIN WAFERS GLASS WAFERS SERVICES: WAFER RECLAIM AND STRIPPING, SLICING, LAPPING, POLISHING, CLEANING AND INSPECTION, LASER MARKING WAFER RECLAIM AND STRIPPING, SLICING, LAPPING, POLISHING, CLEANING AND INSPECTION, LASER MARKING WE PROVIDE TOTAL SOLUTIONS OR CUSTOM PROCESSING FOR CUSTOMERS, SPECIAL SPECS TO MEET YOUR APPLICATIONS. New! Use a Credit Card to purchase. We are pleased to announce we now accept Visa--MasterCard--American Express for any purchase. For improved delivery and service, just call or email to our website. Silicon, SOI, silicon on insulator, glass, germanium, deposition, thin films, oxide, nitride, TiN, Wti, Al, Al alloys, Cu, W, Cr, Ni, NiV7, TaN, Ti, Pt, Au, Ag, Pd, WAFER RECLAIM AND STRIPPING, SLICING, LAPPING, POLISHING, CLEANING AND INSPECTION, LASER MARKING, WAFER RECLAIM AND STRIPPING, SLICING, LAPPING, POLISHING, CLEANING AND INSPECTION, LASER MARKING, SILICON WAFERS FROM 1" TO 12", EPI & POLY WAFERS, SOI OR BONDED WAFERS, TWO SIDE POLISHED WAFERS, ULTRA FLAT, ULTRA THIN WAFERS, GLASS WAFERS, OXIDES: LTO, THERMAL, DOPED, TEOS, NITRIDE: LPCVD, PECVD, METALS, high purity, surface cleaning, crystals, Czochralski, float zone, CZ, FZ, germanium, quartz, semiconductor, optical materials, Arsenic, Antimony, precious metals, single crystal, poly, ceramic, epitaxial, epi, reclaimed, recycled, laser marking, cmp cleaning, bonding, dicing, silicon wafer reclamation, annealing, coating, plating, wafer processing, diffusion, oxidation, etching, wet, dry, grinding, lapping, polishing, metallizing,
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