Angstrom Engineering
48 Highland Rd. W
Kitchener ON Ontario
Canada N2M 3B5
Kitchener ON Ontario
Canada N2M 3B5
Phone:
+1 519 742 7649, Fax: +1 519 742 9467
Tags:
control equipment evaporators flow laboratory pumps
Thin Film Deposition Equipment, Vacuum Glove Box Systems, Custom Thin Film Deposition Systems QUICK LINKS Products CoVap Nexdep ?mod EvoVac Brochures News Contact Us Quote (RFQ) Thin Film Deposition Equipment Angstrom Engineering designs and manufactures PVD equipment with advanced process capabilities for thin film deposition applications. We specialize in thin film technologies such as thermal evaporation, sputtering, electron beam deposition and ion beam etching. Angstrom modular products offer unique configuration flexibility at a competitive price while providing unmatched value through innovative design expertise, exemplary customer support and quality workmanship. Current thin film deposition products include the CoVap an economical system with powerful process control features, the Nexdep a perfect blend between low cost and configuration flexibility, the Amod providing remarkable configuration flexibility in a compact system, and the EvoVac maximizing combined thin film process arrangements. Angstrom Engineering has vast experience in adapting our products for applications including inorganic and organic light emitting diodes (LED, OLED), flat panel display research, solar cell panels, photovoltaics, nanotechnology, materials research, aerospace testing, thin film battery research and much more. We strive to continually support the evolving needs of thin film deposition research and pre-production processes. Many of Angstrom Engineering's products are developed to enhance environmentally sensitive applications by enabling glove box system integration. Our unique glove box design improves ergonomic access to the deposition chamber while maintaining a controlled atmosphere with less than 1ppm of oxygen and moisture. Using an integrated glove box in your thin film process application can also ensure reliable and continuous fine particle removal reducing product contamination during substrate preparation and post process handling. Come meet Angstrom Engineering at the 50th SVC annual technical conference in
